Title:
熱膨張性マイクロカプセル
Document Type and Number:
Japanese Patent JP7129194
Kind Code:
B2
Abstract:
To provide a heat expansion microcapsule having excellent heat resistance, high in expansion ration, and less in content of sodium ion or chloride in.SOLUTION: There is provided a heat expansion microcapsule having a volatile expansion agent a core agent in a shell consisting of a polymer, in which the shell consists of a polymer by polymerizing a monomer composition containing a polymerizable monomer (I) consisting of at least one kind selected from acrylonitrile, methacrylonitrile, and vinylidene chloride of 40 to 90 wt.%, a radical polymerizable unsaturated carboxylic acid monomer (II) having a carboxyl group and having 3 to 8 carbon atoms of 5 to 50 wt.%, a crosslinkable monomer (III) having 2 double bonds in a molecule of 0.1 to 1.0 wt.%, and a metal-containing compound of 0.1 to 10 wt.% based on total amount of the monomer, and having maximum expansion temperature of 190°C or higher and electric conductivity of less than 2.15 mS/m.SELECTED DRAWING: None
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Inventors:
Hiroki Tanaka
Kawaguchi Yasuhiro
Kawaguchi Yasuhiro
Application Number:
JP2018065005A
Publication Date:
September 01, 2022
Filing Date:
March 29, 2018
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
Tokuyama Sekisui Industry Co., Ltd.
Tokuyama Sekisui Industry Co., Ltd.
International Classes:
C09K3/00
Domestic Patent References:
| JP2006002133A | ||||
| JP2006002134A | ||||
| JP2009120660A | ||||
| JP2006045532A | ||||
| JP2007197684A | ||||
| JP2009203451A |
Foreign References:
| WO2006083041A1 | ||||
| WO2010038615A1 | ||||
| WO2010052972A1 |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus