Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDING THEREOF
Document Type and Number:
Japanese Patent JP2016183298
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having excellent thermal decomposition resistance at the time of high temperature molding and at the time of residence under a high temperature environment, and also high solvent resistance.SOLUTION: A thermoplastic resin composition comprises: a methacrylic resin (A) of 100 pts.mass, comprising a methacrylate ester monomer unit of 80-99.9 mass% and another vinyl monomer unit copolymerizable with the methacrylate ester monomer of 0.1-20 mass%; a stabilizer (B) of 0.01-5 pts.mass, comprising a hindered phenolic thermal stabilizer and a hindered amine photostabilizer; and a rubbery copolymer (C) of 20-100 pts.mass.SELECTED DRAWING: None
Inventors:
WATABE MASAHIRO
Application Number:
JP2015065182A
Publication Date:
October 20, 2016
Filing Date:
March 26, 2015
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08L33/10; C08K5/13; C08K5/17; C08L51/00
Domestic Patent References:
| JP2012180454A | 2012-09-20 | |||
| JP2013032513A | 2013-02-14 | |||
| JP2013032509A | 2013-02-14 | |||
| JPH01252653A | 1989-10-09 | |||
| JP2000001596A | 2000-01-07 | |||
| JPH08217944A | 1996-08-27 | |||
| JP2012224687A | 2012-11-15 | |||
| JP2003192920A | 2003-07-09 | |||
| JPH09143303A | 1997-06-03 | |||
| JPH11228769A | 1999-08-24 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito