Title:
A thermoset-epoxy-resin constituent for OPTO semiconductor device closure, and an optical semiconductor device using it
Document Type and Number:
Japanese Patent JP6274092
Kind Code:
B2
Inventors:
Yoshihiro Tsutsumi
Tadashi Tomita
Tadashi Tomita
Application Number:
JP2014244961A
Publication Date:
February 07, 2018
Filing Date:
December 03, 2014
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G59/32; C08G59/24; C08G59/42; C08G59/68; C08L53/00; C08L63/00; C08L63/02; C08L63/06; C08L69/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
JP2008189827A | ||||
JP2012052052A | ||||
JP2015522686A |
Foreign References:
WO2007015426A1 | ||||
WO2006064736A1 |
Attorney, Agent or Firm:
Mamoru Ushiki
Previous Patent: Ink-jet recording device
Next Patent: ENERGY SAVING PERFORMANCE EVALUATION SYSTEM FOR HOUSING
Next Patent: ENERGY SAVING PERFORMANCE EVALUATION SYSTEM FOR HOUSING