Title:
熱硬化性接着剤組成物および半導体装置
Document Type and Number:
Japanese Patent JP5589388
Kind Code:
B2
Inventors:
Murayama Ryuichi
Naoya Kanamori
Koji Makihara
Naoya Kanamori
Koji Makihara
Application Number:
JP2010001244A
Publication Date:
September 17, 2014
Filing Date:
January 06, 2010
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L21/52; C09J4/00; C09J4/02; C09J109/00; C09J201/00