Title:
電子部品用熱硬化性接着剤及びこの接着剤を用いた電子部品内蔵基板の製造方法
Document Type and Number:
Japanese Patent JP5534682
Kind Code:
B2
Inventors:
Kohei Takeda
Hideaki Ishizawa
Akinobu Hayakawa
Ryohei Masui
Hideaki Ishizawa
Akinobu Hayakawa
Ryohei Masui
Application Number:
JP2009025628A
Publication Date:
July 02, 2014
Filing Date:
February 06, 2009
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J163/00; C09J5/06; C09J11/04; C09J11/06; C09J181/00; H01L23/12; H05K1/03; H05K3/28; H05K3/34; H05K3/46
Domestic Patent References:
| JP2001181276A | ||||
| JP2001131260A | ||||
| JP2006176716A | ||||
| JP2003234439A | ||||
| JP2005311249A |
Foreign References:
| WO1997002595A1 |
Attorney, Agent or Firm:
Ryu Iwatani