Title:
特に電子部品およびフレキシブルプリント基板を貼り合わせるための熱接着性かつ熱硬化性の接着フィルム
Document Type and Number:
Japanese Patent JP2011512430
Kind Code:
A
Abstract:
Thermally-activated and hardenable adhesive foil for adhesion of electronic components and flexible printed circuit paths having an adhesive material composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one hardener for the epoxy resin, in which the epoxy groups react chemically with the hardener at high temperatures, in which at least one of the starting materials of the polyurethane is a hydroxyl-functionalized polycarbonate and at least one of the starting materials of the polyurethane has a functionality greater than two
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Inventors:
Schumann Uwe
Stein Alexander
Stein Alexander
Application Number:
JP2010545432A
Publication Date:
April 21, 2011
Filing Date:
January 27, 2009
Export Citation:
Assignee:
Theza Societas Europe
International Classes:
C09J7/00; C09J11/04; C09J11/06; C09J163/00; C09J175/06
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama
Blacksmith
Katsunori Uenishi
Ichiro Torayama