Title:
THERMOSETTING ADHESIVE RESIN COMPOSITION, ADHESIVE FILM, COVERLAY FILM, METAL-CLAD LAMINATE, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016188303
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting adhesive resin composition which has excellent adhesiveness to a polyimide resin after curing, and has excellent elastic modulus at high temperature, solder heat resistance after moisture absorption and flexibility; a coverlay film; an adhesive film; a metal-clad laminate; and a flexible printed wiring board.SOLUTION: There is provided a thermosetting adhesive resin composition which contains an epoxy resin (A) containing a bisphenol F type epoxy resin (A1), a polyvinyl acetal resin (B) having a glass transition temperature of 80°C or higher, and a curing agent (C) having a hydroxyl group, where 30 pts.mass or more and 180 pts.mass or less of the polyvinyl acetal resin (B) is blended based on 100 pts.mass of the epoxy resin (A), the curing agent (C) is blended so that a ratio of the number of hydroxyl groups in the curing agent (C) to the number of epoxy groups in the epoxy resin (A) is 0.5 or more and 1.5 or less, the content of the bisphenol F type epoxy resin (A1) in the epoxy resin (A) is 20 mass% or more and 85 mass% or less, and the bisphenol F type epoxy resin (A1) has 1 or more and 10 or less hydroxyl groups in one molecule.SELECTED DRAWING: None
Inventors:
SENSO TOMOMITSU
NAKAMURA SHOICHIRO
NAKAMURA SHOICHIRO
Application Number:
JP2015068844A
Publication Date:
November 04, 2016
Filing Date:
March 30, 2015
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
C09J163/02; B32B15/08; C08G59/24; C09J7/02; C09J129/14
Attorney, Agent or Firm:
Hiroaki Aoki
Yasuo Morimura
Yasuo Morimura