熱硬化性組成物およびそれを用いたプリント配線板

Title:

熱硬化性組成物およびそれを用いたプリント配線板

Document Type and Number:

Japanese Patent JP5814503

Kind Code:

B2

Abstract:

PURPOSE: A thermosetting composition is provided to be used as a material of a printed circuit board which is light, thin, simple, and small due to excellent thermosetting property, processability, impregnation property, and thermal properties. CONSTITUTION: A thermosetting composition comprises organic solvent 100.0 parts by weight, thermosetting liquid crysyalline oligomer 5-200 parts by weight, and a cross-linking agent or epoxy compound having crosslinkable groups 5 -80 parts by weight. The thermosetting liquid crystalline oligomere is marked as a chemical formula 1. In the chemical formula 1, R^1 is marked as a chemical formula 2 and R^2 is marked as a chemical formula 6. In the chemical formula 1, Z^1 and Z^2 are thermosetting cross-linking reactive groups having multiple bond in the end of the reactive groups.

Inventors:

Zheng Ming
Zhao Shige
Golden light
Carinina Fedosha
Golden Man
Tadamasu Shun

Application Number:

JP2009263321A

Publication Date:

November 17, 2015

Filing Date:

November 18, 2009

Export Citation:

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