Title:
熱硬化性低誘電樹脂組成物及び回路積層板
Document Type and Number:
Japanese Patent JP4392767
Kind Code:
B2
Inventors:
Takeshi Hashimoto
Masaharu Kobayashi
Takeru Sato
Daisuke Orino
Masaharu Kobayashi
Takeru Sato
Daisuke Orino
Application Number:
JP33197898A
Publication Date:
January 06, 2010
Filing Date:
November 06, 1998
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C08L79/08; H05K1/03; B32B15/08; B32B27/34; C08F222/40; C08F226/06
Domestic Patent References:
JP2000143983A | ||||
JP4222863A | ||||
JP480261A | ||||
JP718024A | ||||
JP8193139A |
Attorney, Agent or Firm:
Masaaki Kobayashi