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Title:
THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP2017119774
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, a molding of which shows a linear expansion coefficient of 9 ppm/K or less.SOLUTION: A thermosetting resin composition has (a) thermosetting resin, (b) carbon fiber, and (c) filler, where the contents of the carbon fiber and the filler are 30-100 pts.mass and 120-350 pts.mass based on the thermosetting resin 100 pts.mass.SELECTED DRAWING: None

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Inventors:
KUWAHARA ATSUSHI
ISHIUCHI TAKAHITO
Application Number:
JP2015256995A
Publication Date:
July 06, 2017
Filing Date:
December 28, 2015
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L101/00; C08F283/01; C08F290/06; C08K3/26; C08K7/06; C08K7/14; C08L63/10; C08L67/06
Domestic Patent References:
JPS6069158A1985-04-19
JPH09118830A1997-05-06
JPS6160751A1986-03-28
JPS6427023A1989-01-30
JPS55157615A1980-12-08
JP2005247879A2005-09-15
JP2009209269A2009-09-17
Foreign References:
WO2007055338A12007-05-18
Attorney, Agent or Firm:
Masatake Shiga
Suzuki Mitsuyoshi
Norihiko Ara
Osamu Mikuni



 
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