A thermosetting resin composition, the pre-preg using this, a film with resin, a laminate sheet, a printed wired board, and a semiconductor package

Title:

A thermosetting resin composition, the pre-preg using this, a film with resin, a laminate sheet, a printed wired board, and a semiconductor package

Document Type and Number:

Japanese Patent JP6167850

Kind Code:

B2

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Inventors:

Tomohiko Kotake
Nagai Shunsuke
Hashimoto Shintaro
Shinichiro Abe
Masato Miyatake
Shin Takanezawa
Murai Yo

Application Number:

JP2013223857A

Publication Date:

July 26, 2017

Filing Date:

October 29, 2013

Export Citation:

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Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C08G12/08; B32B5/28; B32B15/08; C08J5/18; C08J5/24; C08L61/22; H01L23/14; H05K1/03

Domestic Patent References:

JP4202529A
JP2011195476A
JP2012001486A
JP2007246628A
JP63264635A

Foreign References:

WO2012099132A1
WO2012099133A1

Attorney, Agent or Firm:

Tamotsu Otani
Kenichi Hirasawa

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