Title:
熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ
Document Type and Number:
Japanese Patent JP6597721
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that satisfactorily exhibits a low curing shrinkage, a low thermal expansion, excellent dielectric properties, and a high elastic modulus, and a prepreg, a film with resin, a laminate, a printed wiring board and a semiconductor package prepared therewith.SOLUTION: A thermosetting resin composition contains an aromatic azomethine compound (A) having at least one aldehyde group in one molecule, a siloxane compound (B) having a primary amino group, and a maleimide compound (C) having an N-substituted maleimide group. There are also provided a prepreg, a film with resin, a laminate, a printed wiring board and a semiconductor package prepared therewith.SELECTED DRAWING: None
Inventors:
Tomohiko Kotake
Nagai Shunsuke
Hashimoto Shintaro
Shinichiro Abe
Masato Miyatake
Shin Takanezawa
Murai Yo
Nagai Shunsuke
Hashimoto Shintaro
Shinichiro Abe
Masato Miyatake
Shin Takanezawa
Murai Yo
Application Number:
JP2017126474A
Publication Date:
October 30, 2019
Filing Date:
June 28, 2017
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08J5/24; C08G12/40; C08G73/00; C08K3/00; C08L79/00; C08L101/02; H05K1/03
Domestic Patent References:
| JP2005148112A | ||||
| JP2015086253A | ||||
| JP2012001486A |
Foreign References:
| WO2012099132A1 |
Attorney, Agent or Firm:
Tamotsu Otani