Title:
A thermosetting resin composition, a tablet, packages for light emitting diodes, those manufacturing methods
Document Type and Number:
Japanese Patent JP5946684
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To impart high fluidity to a curable resin composition for capable of continuing stable manufacturing without causing any unfilled part or weld in transfer molding using the thermosetting resin composition.SOLUTION: A thermosetting resin composition is obtained by keeping a thermosetting resin composition, which is prepared by pre-kneading a component consisting of a resin and a filler, in a condition of 25±5°C for 120 hours, and subsequently performing post-kneading. In the obtained thermosetting resin composition, a spiral flow length (based on the electric functional material industry standard T901 and measured at a mold temperature 170°C, a transfer pressure 7 Mpa, and a curing rate 120 sec) is ≥15% in terms of an elongation percentage relative to that of a thermosetting resin composition obtained by batch kneading without performing separate pre-kneading and post-kneading.
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Inventors:
Launch intelligence
Takanao Iwahara
Takanao Iwahara
Application Number:
JP2012096657A
Publication Date:
July 06, 2016
Filing Date:
April 20, 2012
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08G77/48; C08J3/20; C08K3/00; C08L83/07; C08L83/14; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| JP200297342A |
Attorney, Agent or Firm:
Atomi International Patent Office