Title:
ベンゾキサジン構造を有する熱硬化性樹脂及びその製造方法
Document Type and Number:
Japanese Patent JP4364933
Kind Code:
B2
Abstract:
The present invention provides a thermosetting resin having a benzoxazine ring structure represented by the following formula (I): wherein X is a residue of a diol compound having a molecular weight or a number average molecular weight in terms of polystyrene measured by GPC of 5,000 or less; Y is a residue of a diamine compound; and n is an integer of 2 to 200.
Inventors:
Yuji Eguchi
Kazuo Tsuchiyama
Kazuo Tsuchiyama
Application Number:
JP2008555346A
Publication Date:
November 18, 2009
Filing Date:
July 10, 2008
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08G73/06; C08G14/073
Domestic Patent References:
| JP9059334A | ||||
| JP11080302A | ||||
| JP2007045862A | ||||
| JP2005213301A | ||||
| JP2000154225A | ||||
| JP2002338648A | ||||
| JP2005239827A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki