A thickness measuring device and a method of an internal adhesion thing

Title:

A thickness measuring device and a method of an internal adhesion thing

Document Type and Number:

Japanese Patent JP5957425

Kind Code:

B2

Inventors:

Takizawa truth
Mitsuki Oguro
Saburo Shibata
Tatsuya Hikichi
Ichiro Kajigaya

Application Number:

JP2013163405A

Publication Date:

July 27, 2016

Filing Date:

August 06, 2013

Export Citation:

Assignee:

Ihi Co., Ltd. measurement

International Classes:

G01B17/02; G01N29/04

Domestic Patent References:

Attorney, Agent or Firm:

Minoru Hotta
Toshihiro Nomura

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