Title:
半導体基板の表面皮膜の厚さ測定方法
Document Type and Number:
Japanese Patent JP6650859
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for measuring a thickness of a surface coating of a wafer, by which the thickness of the surface coating formed on the wafer can be measured online with high accuracy.SOLUTION: A method for measuring a thickness of a surface coating 12 of a wafer 11 comprises the steps of: holding the wafer on a support member 53 driven to rotate in contact with a turntable 50 with a polishing cloth 51 provided on its surface; and measuring the thickness of the surface coating of the wafer 11 while supplying a polishing liquid 19 onto the turntable 50. In the method, an optical sensor 13 having a light-output part 15a for applying light to the wafer 11 through the polishing cloth 51 and the turntable 50, and a light-input part 16a for receiving reflected light from the wafer 11 is provided. Further, in the method, a transparent substance 20 having a refraction index which is the same as that of the polishing liquid 19 in a range of 0.9-1.1 times is disposed between the optical sensor 13 and the surface coating 12 to measure the thickness of the surface coating 12.SELECTED DRAWING: Figure 2
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Inventors:
Oniki Takagen
Toshiaki Naka
Masaaki Matsuo
Yasunori Tashiro
Megumi Suzuki
Kacheon Lung Luang Panath
Toshiaki Naka
Masaaki Matsuo
Yasunori Tashiro
Megumi Suzuki
Kacheon Lung Luang Panath
Application Number:
JP2016202457A
Publication Date:
February 19, 2020
Filing Date:
October 14, 2016
Export Citation:
Assignee:
Mishima Kosan Co., Ltd.
Kyushu Institute of Technology
Kyushu Institute of Technology
International Classes:
H01L21/304; B24B37/013; B24B49/04; B24B49/12
Domestic Patent References:
| JP2012525714A | ||||
| JP2003042721A | ||||
| JP2011029505A | ||||
| JP2017052027A |
Attorney, Agent or Firm:
Fujio Nakamae
Yohei Kiyoi
Yoshihiro Kurita
Yohei Kiyoi
Yoshihiro Kurita