Title:
LOW-PROFILE REDUCED PRESSURE TREATMENT SYSTEM
Document Type and Number:
Japanese Patent JP2016172017
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a low-profile reduced pressure treatment apparatus and system.SOLUTION: An apparatus 100 includes a moldable conduit holder, a conduit 130 passing through the conduit holder, and a flexible base. The conduit holder has first and second bulkhead surfaces, a convex top surface, and a bottom surface adapted to conform to a tissue contact region adjacent to a tissue site 120. An end of the conduit is substantially flush with the first bulkhead surface, and a longitudinal axis of the conduit is substantially perpendicular to the first and second bulkhead surfaces. The base is connected on a first side to the bottom surface of the conduit holder, and extends beyond the first bulkhead surface to form an overlay zone adjacent to the first bulkhead surface. An adhesive is disposed on a second side of the flexible base to secure the flexible base to the tissue contact region.SELECTED DRAWING: Figure 1
Inventors:
WILKES ROBERT PEYTON
Application Number:
JP2016092233A
Publication Date:
September 29, 2016
Filing Date:
May 02, 2016
Export Citation:
Assignee:
KCI LICENSING INC
International Classes:
A61M27/00
Domestic Patent References:
| JP2005528167A | 2005-09-22 | |||
| JP2007509683A | 2007-04-19 | |||
| JP2003532504A | 2003-11-05 |
Foreign References:
| US6071267A | 2000-06-06 | |||
| US20050004534A1 | 2005-01-06 | |||
| US20030050594A1 | 2003-03-13 | |||
| US20040243073A1 | 2004-12-02 |
Attorney, Agent or Firm:
Mieko Kashihara