Title:
THREE-DIMENSIONAL MOLDING APPARATUS AND THREE-DIMENSIONAL MOLDING METHOD
Document Type and Number:
Japanese Patent JP2017196890
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus and method capable of reducing surface ruggedness of a three-dimensional molding.SOLUTION: A molding liquid is sprayed onto a surface of a molding 32 formed by joining molding powder, by a spray nozzle of an apparatus for applying an adhesive agent, so that the liquid is supplied onto the surface of the three-dimensional molding 32. Thereafter, small diameter powder 35 is sprayed onto the surface of the three-dimensional molding 32 by small diameter powder supply means 41 configured to supply the small diameter powder 35 having smaller average particle diameter than the molding powder and made of the same material as the molding powder.SELECTED DRAWING: Figure 9
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Inventors:
SAKURA SEIZO
Application Number:
JP2017019622A
Publication Date:
November 02, 2017
Filing Date:
February 06, 2017
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
B29C67/00; B22F1/02; B22F3/105; B22F3/16; B33Y10/00; B33Y30/00
Domestic Patent References:
| JP2000328106A | 2000-11-28 | |||
| JP2002038201A | 2002-02-06 | |||
| JP2015193134A | 2015-11-05 |
Foreign References:
| WO2015100086A1 | 2015-07-02 | |||
| KR20150141203A | 2015-12-18 |
Attorney, Agent or Firm:
Toshi Kuroda