Title:
A three-dimensional laminate shaping apparatus and a three-dimensional laminate molding method
Document Type and Number:
Japanese Patent JP6273578
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a three-dimensional laminate molding apparatus and a three-dimensional laminate molding method, which make it possible to mold a satisfactory molded object by making a temperature distribution of a powder sample laid over a stage uniform.SOLUTION: A three-dimensional laminate molding apparatus 1 includes a stage 4, a first electron gun 8, and a second electron gun 9. The first electron gun 8 melts a predetermined powder sample M1. The second electron gun 9 preheats the powder sample M1 by irradiating an electron beam I2 to the powder sample M1 laid over the stage 4.
Inventors:
Akihiko Chiba
Honda Kazuhiro
Honda Kazuhiro
Application Number:
JP2014072220A
Publication Date:
February 07, 2018
Filing Date:
March 31, 2014
Export Citation:
Assignee:
JEOL Ltd.
Tohoku University
Tohoku University
International Classes:
B22F3/105; B22F3/16; B29C67/00
Domestic Patent References:
| JP9504055A | ||||
| JP2014028996A | ||||
| JP2015120340A | ||||
| JP9507882A | ||||
| JP2008037024A |
Foreign References:
| WO2013179017A1 |
Attorney, Agent or Firm:
Shinto International Patent Office