Title:
プレス装置のためのツールヘッド組立体
Document Type and Number:
Japanese Patent JP5474959
Kind Code:
B2
Abstract:
A tool head assembly for a pressing device includes a tool head frame having a first die and a moving ram having a second die operatively coupled to the moving ram. The moving ram is movable along a gripping stroke between an open position and a closed position. The second die is configured to hold a work piece between the second die and the first die when the moving ram is in the closed position. The tool head assembly also includes a latch mechanism, wherein the latch mechanism is actuated to release the moving ram from the open position to the closed position to thereby hold the work piece within the tool head assembly.
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Inventors:
College, david, alan
Application Number:
JP2011517406A
Publication Date:
April 16, 2014
Filing Date:
June 30, 2009
Export Citation:
Assignee:
Tyco Electronics Corporation
International Classes:
B25B25/00; B30B1/32; B30B12/00
Domestic Patent References:
| JP46007440B1 | ||||
| JP57181568U | ||||
| JP51004268B1 |
Attorney, Agent or Firm:
Tyco Electronics Corporation