Title:
A transportation method of a brittle material board
Document Type and Number:
Japanese Patent JP6186940
Kind Code:
B2
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Inventors:
Kinya Ota
Naohiro Kuroda
Yuro Iwatsubo
Satoshi Isoshima
Naohiro Kuroda
Yuro Iwatsubo
Satoshi Isoshima
Application Number:
JP2013133445A
Publication Date:
August 30, 2017
Filing Date:
June 26, 2013
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
H01L21/677; B28D5/00; B28D7/04; H01L21/301
Domestic Patent References:
| JP2009004474A | ||||
| JP2010118424A | ||||
| JP2009094247A | ||||
| JP9069551A | ||||
| JP5343507A | ||||
| JP2008235472A |
Attorney, Agent or Firm:
Yoshiki Okamoto