Title:
A treating solution generating device, a treating solution generation method, a substrate processing device, and a substrate treating method
Document Type and Number:
Japanese Patent JP5989338
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and method for generating a processing liquid, and an apparatus and method for processing a substrate, capable of improving a processing performance while preventing static charge.SOLUTION: A substrate processing apparatus 1 includes: a melting unit 3A for dissolving a carbon dioxide gas to liquid; a bubble generating unit 5A for generating a plurality of microbubbles in the liquid by a bubble generating gas while maintaining a dissolution amount of the carbon dioxide gas to the liquid; and a processing unit 6 for processing a substrate using the liquid containing a plurality of microbubbles obtained by dissolving the carbon dioxide gas.
Inventors:
Hirose road
Atsushi Kinase
Hirotaka Koyama
Kunihiro Miyazaki
Takashi Miyamoto
Sho Toita
Hiroshi Josho
Atsushi Kinase
Hirotaka Koyama
Kunihiro Miyazaki
Takashi Miyamoto
Sho Toita
Hiroshi Josho
Application Number:
JP2011288361A
Publication Date:
September 07, 2016
Filing Date:
December 28, 2011
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
B01F1/00; B01F3/04; B01F5/06; H01L21/304
Domestic Patent References:
| JP2002172318A | ||||
| JP2005093873A | ||||
| JP62294475A | ||||
| JP2004344821A |
Foreign References:
| WO2008050832A1 |
Attorney, Agent or Firm:
Misawa patent office
Shinichi Ogawa
Fumihiko Nakahara
Shinichi Ogawa
Fumihiko Nakahara
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