PURPOSE: To facilitate circuit characteristics test of a semiconductor IC wafer chip using outside mounted resistors, by forming resistor elements connected with the internal circuit of a chip, in a scribe line region.

CONSTITUTION: Chips 2a, 2b formed on an IC wafer 1 are divided by a scribe line region 12. Signal pads 3, 4 for signal interface to the outside and a power supply pad 5 for power supply interface are arranged on each of the chips 2a, 2b. Resistors 10, 11 for test use are formed on the scribe line region 12, and one terminal of the resistor 10 is connected with the signal pad 3 through a signal line 6. In the same way, one end of the resistor 11 is connected with the signal pad 4 through a signal line 7. The cower supply pad 5 is connected with a power supply line 9 through a poxyer supply line 8. The power supply line 9 is formed on the scribe line region 12, and commonly connected with one end of a plurality of resistors like the resistors 10, 11. Thereby circuit characteristic test can be facilitated.