Title:
An ultrasonic device, a manufacturing method for the same, electronic equipment, and an ultrasonographic image device
Document Type and Number:
Japanese Patent JP6252130
Kind Code:
B2
Abstract:
An ultrasonic device (17) includes a substrate (44), an acoustic adjustment layer (51), an acoustic lens (52) and a structural member (53). The substrate has an element array (22) including a plurality of thin film ultrasonic transducer elements (28) arranged in an array form. The acoustic adjustment layer covers the element array. The acoustic lens is arranged above the acoustic adjustment layer. The structural member is in contact with the acoustic lens and fixed to the substrate. The structural member has a modulus of rigidity greater than a modulus of rigidity of the acoustic lens.
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Inventors:
Kiyose Setouchi
Application Number:
JP2013240277A
Publication Date:
December 27, 2017
Filing Date:
November 20, 2013
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
A61B8/00; H04R17/00; H04R31/00
Domestic Patent References:
| JP2003061957A | ||||
| JP2007130357A | ||||
| JP58166195U | ||||
| JP60191600A | ||||
| JP6201664A |
Foreign References:
| WO2010092907A1 | ||||
| US5577507 |
Attorney, Agent or Firm:
Inoue Ichi
Takekoshi Noboru
Yasushi Kuroda
Takekoshi Noboru
Yasushi Kuroda
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