Title:
ULTRASONIC PROBE AND BACKING MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2020031328
Kind Code:
A
Abstract:
To improve the acoustic and electrical characteristics of backing including a lead array.SOLUTION: Backing is constituted by a plurality of stacked backing plates. Each of the backing plates is constituted by a row of leads and a backing material 92. Each of the leads is constituted by a lead wire 36b and an insulating film 36a. The insulating film 36a is integral with the backing material 92 with no adhesive layer therebetween. A short circuit between the leads 36 is prevented or reduced by the insulating film 36a. When the backing plate is manufactured, a screen printing method is used.SELECTED DRAWING: Figure 14
Inventors:
KATSURA HIDETSUGU
TAWARA YOSHIHIRO
KOBAYASHI KAZUHIRO
TAWARA YOSHIHIRO
KOBAYASHI KAZUHIRO
Application Number:
JP2018155661A
Publication Date:
February 27, 2020
Filing Date:
August 22, 2018
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H04R17/00; A61B8/14; H04R31/00
Domestic Patent References:
| JP2018027235A | 2018-02-22 | |||
| JPH0865797A | 1996-03-08 | |||
| JP2015225898A | 2015-12-14 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office