Title:
【発明の名称】回路アーキテクチャーを備えたユニバーサルエネルギー調整インターポーザー
Document Type and Number:
Japanese Patent JP2003506878
Kind Code:
A
Abstract:
The present invention relates to an interposer substrate (310) for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit (4100) chips in either a single or a combination, and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source.
Inventors:
Anthoni, Anthoni, A
Application Number:
JP2001514521A
Publication Date:
February 18, 2003
Filing Date:
August 03, 2000
Export Citation:
Assignee:
Exto Wai, Attenuators, Elle, Elle, C
International Classes:
H01L23/498; H01L23/32; H01L23/50; H01L23/552; H03H1/00; H05K1/14; H05K1/16; H05K3/34; (IPC1-7): H01L23/32
Domestic Patent References:
| JPH0653075A | 1994-02-25 | |||
| JPH07307412A | 1995-11-21 | |||
| JPH0936616A | 1997-02-07 | |||
| JPH09283700A | 1997-10-31 | |||
| JPH06325133A | 1994-11-25 | |||
| JPH0536859A | 1993-02-12 | |||
| JPH08316377A | 1996-11-29 |
Attorney, Agent or Firm:
Sanada Yuzo (2 outside)