Title:
感放射線性樹脂組成物、その層間絶縁膜およびマイクロレンズの形成への使用、ならびに層間絶縁膜およびマイクロレンズ
Document Type and Number:
Japanese Patent JP4524944
Kind Code:
B2
Abstract:
PURPOSE: To provide a radiation sensitive resin composition having high radiation sensitivity and a sufficient margin for development, capable of easily forming a patterned thin film excellent in adhesion and suitable for forming an interlayer insulating film and microlenses, to provide a use of the composition for an interlayer insulating film and microlenses and to provide an interlayer insulating film and microlenses formed from the composition. CONSTITUTION: The radiation sensitive resin composition contains £A| a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy-containing unsaturated compound, (a3) a hydroxyl- containing unsaturated compound and (a4) another olefinically unsaturated compound and £B| a 1,2-quinonediazido compound. The interlayer insulating film and the microlenses are formed by using the composition.
More Like This:
| JP2000136230 | PHOTOSENSITIVE RESIN COMPOSITION |
| JPH04291261 | RESIST COMPOSITION |
| JP6807148 | Photosensitive composition |
Inventors:
Isao Nishimura
Nobuhiro Takeuchi
Hideki Nishimura
Kazuaki Niwa
Nobuhiro Takeuchi
Hideki Nishimura
Kazuaki Niwa
Application Number:
JP2001091877A
Publication Date:
August 18, 2010
Filing Date:
March 28, 2001
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/023; C08J5/00; G03F7/032; C08J5/18; C08K5/28; C08L33/00; C08L35/00; C08L101/12; G02B1/04; G03F7/022
Domestic Patent References:
| JP11052560A | ||||
| JP10207057A | ||||
| JP10153854A | ||||
| JP8262709A | ||||
| JP2000347397A | ||||
| JP2000327877A |