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Patent Searching and Data


Title:
A vacuum device, its pressure control method, and an etching method
Document Type and Number:
Japanese Patent JP6080506
Kind Code:
B2
Abstract:
A vacuum device which controls pressure within a processing container through an APC valve suppresses a rapid pressure change. According to priority of step S1 to S5, a pressure change within a processing container (1) can be suppressed. In a step S1, an EC (81) obtains an opening ratio of an APC valve (55). In a step S2, it is determined that the opening ratio of the APC valve (55) obtained in the step S1 exceeds a first threshold value by determining the opening ratio of the EC (81). If the opening ratio exceeds the first threshold value in the step S2, an exceeding counter (124) integrates an exceeding count value in a step S3. In a step S4, it is determined that an integration value of the exceeding count value counted in the exceeding counter (124) exceeds a second threshold value. If the exceeding count value exceeds the second threshold value, a flow control unit (121a) transmits a control signal to reduce a flux of processing gas as a predetermined amount regarding a mass flow controller (MFC) (43) by passing an MC (83).

Inventors:
Hiroshi Yamamoto
Hirose Koji
Application Number:
JP2012245007A
Publication Date:
February 15, 2017
Filing Date:
November 07, 2012
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; B01J3/02; H01L21/205
Domestic Patent References:
JP7211693A
JP2001081545A
JP2009049383A
JP2008072030A
JP4147620A
JP10270432A
JP2007027661A
JP2006140237A
Foreign References:
US20080067146
Attorney, Agent or Firm:
Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa