Title:
A valuation method of a SiC epitaxial wafer
Document Type and Number:
Japanese Patent JP6069545
Kind Code:
B2
Inventors:
Kageshima
Daisuke Muto
Kenji Momose
Yoshihiko Miyasaka
Daisuke Muto
Kenji Momose
Yoshihiko Miyasaka
Application Number:
JP2016008570A
Publication Date:
February 01, 2017
Filing Date:
January 20, 2016
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
C30B29/36
Domestic Patent References:
| JP2011121847A | ||||
| JP2008311542A |
Attorney, Agent or Firm:
Masatake Shiga
Suzuki Mitsuyoshi
Norihiko Ara
Osamu Mikuni
Suzuki Mitsuyoshi
Norihiko Ara
Osamu Mikuni
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