Title:
PROCESSED WORKPIECE EVALUATION METHOD
Document Type and Number:
Japanese Patent JP2017181111
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a processed workpiece evaluation method that enables an evaluation of a gettering property of a processed workpiece on a production line.SOLUTION: A processed workpiece evaluation method is configured to evaluate a gettering property of a device wafer W having a plurality of devices formed on a surface WS, and having a gettering layer G internally formed. The processed workpiece evaluation method includes: an excitation light irradiation step of irradiating the device wafer W with excitation light L for exciting a carrier in the device wafer W; a microwave irradiation step of irradiating an irradiation range R of the excitation light L of the device wafer W and an out-of-irradiation range R of the excitation light L thereof with a microwave MT, respectively; a measurement step of measuring intensity of a reflection wave of the microwave MR from the device wafer W, respectively, and deriving a difference signal subtracting the intensity of the reflection wave coming from the out-of-irradiation range R from the intensity of the reflection wave coming from the irradiation range R; and a step of judging the gettering property on the basis of intensity of the difference signal calculated in the measurement step.SELECTED DRAWING: Figure 5
Inventors:
SUKEGAWA NAOYA
HARADA SEIJI
HARADA SEIJI
Application Number:
JP2016064621A
Publication Date:
October 05, 2017
Filing Date:
March 28, 2016
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
G01N22/00; H01L21/66
Domestic Patent References:
| JP2016012595A | 2016-01-21 | |||
| JP2011069661A | 2011-04-07 | |||
| JP2016012594A | 2016-01-21 | |||
| JPS63268252A | 1988-11-04 |
Foreign References:
| US20150377779A1 | 2015-12-31 |
Attorney, Agent or Firm:
Sakai International Patent Office