A wafer base material and a manufacturing method for the same

Title:

A wafer base material and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP5911750

Kind Code:

B2

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Inventors:

Kageyama Kagehiro
Shigeru Uchida
Takeshi Asaga
Tetsuyuki Takigami
Ryo Uchida
Horiguchi Hide

Application Number:

JP2012110574A

Publication Date:

April 27, 2016

Filing Date:

May 14, 2012

Export Citation:

Assignee:

ULVAC Deposition Co., Ltd.
Fine Surface Technology Co., Ltd.

International Classes:

B24B41/06; B24B29/00

Domestic Patent References:

Attorney, Agent or Firm:

Masatake Shiga
Shingo Suzuki

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