Title:
WAFER BOAT
Document Type and Number:
Japanese Patent JP2023179113
Kind Code:
A
Abstract:
To provide a technique for preventing cracking generated from a coupling part of a columnar and a bottom plate in a wafer boat.SOLUTION: A wafer boat comprises: a plurality of columns and a bottom plate, which are made by silicon, respectively. In the wafer boat, on a front surface of the bottom plate, each of the columns is provided with a position relation that a shaft wire extended along their front and back directions is surrounded. The bottom plate comprises: a plurality of concave parts that is formed with the position relation that the shaft wire is surrounded on their front surface side, and in which a lower end side of each column is fitted; and a plurality of projection parts that surrounds each shaft wire in a uniform angle interval, and is formed with the position relation that it is separated from each concave part by 6 or more mm in a plan view crossed to the shaft wire.SELECTED DRAWING: Figure 4
Inventors:
SUKAGAWA TOMOO
SAITO TAKEO
SAITO TAKEO
Application Number:
JP2022092201A
Publication Date:
December 19, 2023
Filing Date:
June 07, 2022
Export Citation:
Assignee:
FERROTEC HOLDINGS CORP
International Classes:
H01L21/683; H01L21/22; H01L21/31; H01L21/324
Attorney, Agent or Firm:
Nagoya International Patent Attorney Corporation
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