Title:
【発明の名称】ウェハ検査方法および装置
Document Type and Number:
Japanese Patent JP2996193
Kind Code:
B2
Abstract:
A wafer defect detection apparatus includes a moving device for moving the wafer in a parallel direction to the wafer's surface, a light-emitting device for emitting an incident light on the surface of the wafer, a light-receiving device for receiving a reflected light reflected by the (111) crystal plane of the wafer, and a rotating device for rotating the wafer with respect to a line perpendicular to the wafer surface as a rotation axis, the [001] direction of the wafer being parallel to the normal line direction of the surface of the wafer. The light-emitting device is arranged in the direction tilted by (57.7 DEG - alpha ) from the rotation axis and the incident light impinges on the position where the rotation axis intersects the surface of the wafer. The light-receiving device is arranged in the direction tilted by (54.7 DEG + alpha ) in the direction same as that of the light-emitting device from the rotation axis, and the value of alpha is -35.3 DEG to 35.3 DEG excluding 0 DEG .
Inventors:
Takashi Ide
Application Number:
JP644297A
Publication Date:
December 27, 1999
Filing Date:
January 17, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L21/66; G01N21/88; G01N21/94; G01N21/95; G01N21/956; (IPC1-7): H01L21/66; G01N21/88
Domestic Patent References:
| JP8292021A | ||||
| JP7318504A |
Attorney, Agent or Firm:
Wakabayashi Tadashi