Title:
The wafer maintenance object for semiconductor manufacturing devices
Document Type and Number:
Japanese Patent JP5942380
Kind Code:
B2
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Inventors:
Isao Kimura
Daisuke Shimao
Masuhiro Natsuhara
Akira Mikumo
Hirohiko Nakata
Daisuke Shimao
Masuhiro Natsuhara
Akira Mikumo
Hirohiko Nakata
Application Number:
JP2011230670A
Publication Date:
June 29, 2016
Filing Date:
October 20, 2011
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/683; H01L21/3065; H01L21/31
Domestic Patent References:
| JP2009054871A | ||||
| JP2004307939A | ||||
| JP2002313900A | ||||
| JP2003133233A | ||||
| JP2002260829A | ||||
| JP2002514010A |
Attorney, Agent or Firm:
Noriyuki Tsujikawa
Masao Yamamoto
Masao Yamamoto