Title:
A wafer map controlling device of a Di mounting system
Document Type and Number:
Japanese Patent JP6053195
Kind Code:
B2
Inventors:
Hosaka Eki
Tomonori Iwase
Tsuge Kuniaki
Nobuhisa Omiyama
Tomonori Iwase
Tsuge Kuniaki
Nobuhisa Omiyama
Application Number:
JP2014512256A
Publication Date:
December 27, 2016
Filing Date:
April 27, 2012
Export Citation:
Assignee:
Fuji Machine Manufacturing Co., Ltd.
International Classes:
H01L21/52; H01L21/02; H01L21/66
Domestic Patent References:
| JP7235557A | ||||
| JP2009105151A | ||||
| JP2008251619A | ||||
| JP2001209520A | ||||
| JP2000091403A | ||||
| JP2006332468A | ||||
| JP2004140084A |
Foreign References:
| US20070184564 |
Attorney, Agent or Firm:
Muneo Kako
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