Title:
A wafer processing object, temporary adhesion material for wafer processing, and a manufacturing method of a thin wafer
Document Type and Number:
Japanese Patent JP6023737
Kind Code:
B2
Abstract:
The present invention is a temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, containing a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer (A) capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and capable of releasably adhering to the support. There can be provided a wafer processing laminate and a temporary adhesive material for a wafer processing that facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method for manufacturing a thin wafer using the same.
Inventors:
Michihiro Sugo
Hiroyuki Yasuda
Shohei Tagami
Masato Tanabe
Hiroyuki Yasuda
Shohei Tagami
Masato Tanabe
Application Number:
JP2014055370A
Publication Date:
November 09, 2016
Filing Date:
March 18, 2014
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J11/04; H01L21/304; C09J11/06; C09J183/04; C09J183/06; C09J201/00; H01L21/02; H01L21/683
Domestic Patent References:
| JP5975528B2 | ||||
| JP5767161B2 | ||||
| JP5767159B2 | ||||
| JP2013110391A | ||||
| JP2014040574A | ||||
| JP2014514728A |
Attorney, Agent or Firm:
Mikio Yoshimiya