Title:
ウェハ移送ボックス
Document Type and Number:
Japanese Patent JP7421823
Kind Code:
B2
Abstract:
A wafer transport box according to an embodiment of the present disclosure includes a lower housing including a bottom plate and at least one lower rib which is formed vertically on an upper surface of the bottom plate and which forms a wall formed in an arc shape so that wafers are stacked in an inner space, an upper housing including an upper plate and an upper rib which is formed vertically on a lower surface of the upper plate and which forms a wall formed in an arc shape, and a sidewall member coupled inside the lower rib. Further, when the upper housing and the lower housing are coupled to each other, the sidewall member fixes the wafers stacked in the inner space.
Inventors:
Kim, San Jin
Application Number:
JP2022118503A
Publication Date:
January 25, 2024
Filing Date:
July 26, 2022
Export Citation:
Assignee:
3S Korea Co., Ltd.
International Classes:
H01L21/673; B65D85/30
Domestic Patent References:
| JP2006527919A | ||||
| JP2005347734A | ||||
| JP2013508997A | ||||
| JP2004262545A | ||||
| JP9129719A | ||||
| JP2008141131A |
Attorney, Agent or Firm:
Patent Attorney Corporation R&C