Title:
水性エマルジョン
Document Type and Number:
Japanese Patent JP7388910
Kind Code:
B2
Abstract:
To provide aqueous emulsion which has a low content of an aggregate, is excellent in coating property, and is excellent in water-resistant adhesion and heat-resistant adhesion when being used as an adhesive, and an adhesive using the same.SOLUTION: Aqueous emulsion contains a dispersant and a dispersoid. The dispersant contains modified PVA (A). The dispersoid contains a polymer (C) including an ethylenically unsaturated monomer unit. The modified PVA (A) has a degree of viscosity average polymerization of 200-3,000, a degree of saponification of 80-99.7 mol%, and has a double bond derived from an esterification agent of 0.01 mol% or more and less than 0.50 mol% in its side chain. The esterification agent is a carboxylic acid having a carbon-carbon double bond and/or its derivative. A peak width W0.05h at a height position of 5% from a base line at a peak measured by HPLC is 2.85 minutes or more and less than 3.70 minutes.SELECTED DRAWING: None
More Like This:
Inventors:
Eriko Imaoka
Application Number:
JP2019231173A
Publication Date:
November 29, 2023
Filing Date:
December 23, 2019
Export Citation:
Assignee:
KURARAY CO.,LTD.
International Classes:
C08L29/04; C08F2/24; C08F8/14; C08F18/04; C09J129/04
Domestic Patent References:
| JP4296302A |
Foreign References:
| WO2019198754A1 |
Attorney, Agent or Firm:
Koichi Kamada
Yasuaki Tamura
Yasuaki Tamura
Previous Patent: double sided adhesive tape
Next Patent: Semiconductor device and its manufacturing method
Next Patent: Semiconductor device and its manufacturing method