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Title:
PRODUCTION OF PELLICLE FRAME AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0619124
Kind Code:
A
Abstract:

PURPOSE: To decrease the adhering amt. of the adhesive to be mounted to the end face of a pellicle frame in order to adhere the pellicle frame to a photomask by providing a groove at the center of the end face of the pellicle frame.

CONSTITUTION: The center at the end face of the pellicle frame 101 is provided with the groove 105 over the entire circumference thereof. The adhesive 102 having flexibility and a protective seal 104 for protecting the adhesive surface are mounted thereto. The photomask 103 is transported and thereafter, the pellicle is taken out of a case and is so mounted to the photomask 103 as to cover the pattern thereof by peeling the protective seal 104 for the adhesive. The pellicle frame 101 is thereafter pressed to securely mount the photomask 103 and the pellicle frame 101 in such a manner that the photomask and the pellicle frame are not peeled. The adhesive 102 is then deformed and is spread over the entire part of the groove 105 to completely fill the groove 105, by which the adhesive is tightly adhered to the photomask 103 and the pellicle is securely mounted to the photomask 103.


Inventors:
SHINDOU CHINATSU
Application Number:
JP17412292A
Publication Date:
January 28, 1994
Filing Date:
July 01, 1992
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G03F1/64; H01L21/027; (IPC1-7): G03F1/14; H01L21/027
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)



 
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