Title:
基板補強用繊維織物、並びに該補強用繊維織物を使用したプリプレグ、及びプリント配線板用基板
Document Type and Number:
Japanese Patent JP4467449
Kind Code:
B2
Abstract:
To provide a substrate of printed circuit board with improved coupling reliability, productivity together with increment of wiring density and prepreg for the same and to provide a woven fabric for reinforcement suitable for the same.
The invention relates to the woven fabric consists of warp and weft yarn and has a double woven structure comprising a front structure and a back structure which has a structure exchanging the front structure and the back structure called as Futsu weave (a reversible figured weave by a Japanese-style weaving method).
COPYRIGHT: (C)2006,JPO&NCIPI
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Inventors:
Yoshinori Gondo
Yasuyuki Kimura
Someya Makoto
Yasuyuki Kimura
Someya Makoto
Application Number:
JP2005050311A
Publication Date:
May 26, 2010
Filing Date:
February 25, 2005
Export Citation:
Assignee:
Asahi Kasei E-materials Co., Ltd.
International Classes:
D03D11/00; D03D1/00; D03D15/12; H05K1/03
Domestic Patent References:
| JP2001055642A | ||||
| JP63243349A |
Foreign References:
| WO2005075724A1 |
Attorney, Agent or Firm:
Yoshio Narui
Hideo Takei
Yoshiaki Matsui
Hideo Takei
Yoshiaki Matsui