Title:
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2017168493
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a preferred singulation method when singulating wiring boards having core substrates made of brittle material, and a wiring board manufactured by the method.SOLUTION: A wiring board includes a core substrate; an interlayer insulation resin layer laminated on the core substrate; a wiring layer laminated on the core substrate or the interlayer insulation resin layer; and a stress relief resin formed on the core substrate so as to surround the wiring layer. In a step for singulating the wiring board, the stress relaxation resin is cut.SELECTED DRAWING: Figure 2
Inventors:
KANO NORIKO
NITTA YUKI
NITTA YUKI
Application Number:
JP2016049504A
Publication Date:
September 21, 2017
Filing Date:
March 14, 2016
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H05K1/02; H01L21/301; H01L23/14; H05K3/00
Domestic Patent References:
| JP2015231004A | 2015-12-21 | |||
| JP2005216941A | 2005-08-11 | |||
| JP2009146988A | 2009-07-02 | |||
| JP2015207580A | 2015-11-19 | |||
| JPS62112348A | 1987-05-23 |