A wiring board and a manufacturing method for the same - Shinko Electric Industry Co., Ltd.

Title:

A wiring board and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP6057641

Kind Code:

B2

Abstract:

A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole.

Inventors:

Kazuhiro Kobayashi
Kotaro Kotani
Junichi Nakamura
Kentaro Kaneko

Application Number:

JP2012206743A

Publication Date:

January 11, 2017

Filing Date:

September 20, 2012

Export Citation:

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