Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2023114211
Kind Code:
A
Abstract:
To provide wiring boards with excellent signal transmission quality.SOLUTION: A wiring board 1 of the embodiment has a plurality of alternately stacked insulating layers 11a, 11b, 11c and conductor layers 12a, 12b, 12c, a plurality of sub-substrates 10A, 10B, 10C, which are spaced apart from each other in the planar direction, and a sealing layer 100 filling a gap between the plurality of sub-substrates 10A, 10B, 10C and bonding the plurality of sub-substrates 10A, 10B, 10C together. At least two of the plurality of sub-substrates 10A, 10B, 10C have conductor layers of different thicknesses from each other.SELECTED DRAWING: Figure 1
Inventors:
KIMURA RYOYA
KURODA NOBUHISA
KURODA NOBUHISA
Application Number:
JP2022016453A
Publication Date:
August 17, 2023
Filing Date:
February 04, 2022
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H01L23/12
Attorney, Agent or Firm:
Patent Attorney Corporation Asahina Patent Office