WIRING BOARD

Japanese Patent JP2023170480

A

To improve the quality of a wiring board.SOLUTION: A wiring board includes: a core board 100 having a first surface 100F and a second surface 100S which is on the opposite side to the first surface 100F; a first build-up part 10, formed on the first surface 100F of the core board 100, which includes a plurality of insulation layers 11, 111 and conductor layers 12, 112; and a coating insulation layer 110 which coats an outermost surface of the first build-up part 10. The first build-up part 10 includes: the first insulation layer 111 which is on the outermost side of the plurality of insulation layers 11, 111; and the first conductor layer 112 which is formed on the first insulation layer 111 and includes a first conductor pad P1. The coating insulation layer 110 has an opening 110a from which an upper surface and a lateral surface of the first conductor pad P1 are entirely exposed. The tensile strength of the first insulation layer 111 is greater than that of the insulation layer 11 which is other than the first insulation layer 111 in the first build-up part 10.SELECTED DRAWING: Figure 1

JP6503754	Thermosetting resin composition, prepreg, film with resin, laminated board, multilayer printed wiring board and semiconductor package
JPH0786881	PROBLEM TO BE SOLVED: To determine a wiring route.

KATO MASATAKA
SAKAI SHUNSUKE
TAWATARI MASAHIDE
IKEDA KOSUKE

JP2022082280A

December 01, 2023

May 19, 2022

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IBIDEN CO LTD

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Patent Attorney Corporation Asahina Patent Office

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