Title:
配線基板
Document Type and Number:
Japanese Patent JP7114690
Kind Code:
B2
Abstract:
A wiring substrate comprises a first substrate 10, a second substrate 20 which includes a frame body 21a located on the outer circumferential edge of the first substrate 10, at least two connecting parts 25 connected to the inner circumferential part of the frame body 21a, and a support body 21b connecting the two connecting parts 25 to each other, and a third substrate 30 located on a surface of the second substrate 20 opposite the first substrate. The support body 21b includes a direction changing part 27 between the two connecting parts 25 and does not include an annular structure where the direction changing part 27 is included on the circumference.
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Inventors:
Keizo Sakurai
Application Number:
JP2020507382A
Publication Date:
August 08, 2022
Filing Date:
January 24, 2019
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/14
Domestic Patent References:
| JP2000138525A | ||||
| JP2017028245A |
Foreign References:
| US20090067141 |
Attorney, Agent or Firm:
Beech International Patent Office