Title:
配線基板
Document Type and Number:
Japanese Patent JP7345514
Kind Code:
B2
Abstract:
A wiring substrate (1) includes a first ceramic layer (21) and a second ceramic layer (22). A plurality of wiring traces (31) which are electrically independent of one another are provided between the first ceramic layer (21) and the second ceramic layer (22). Each wiring trace (31) has a protruding portion (31a) which protrudes onto the first ceramic layer (21) surrounded by the second ceramic layer (22) when viewed from above. An insulating coat (41) is provided to cover a portion of a concave corner (C) formed by the second ceramic layer (21) and the first ceramic layer (22).
More Like This:
Inventors:
Kensuke Matsuhashi
Application Number:
JP2021032606A
Publication Date:
September 15, 2023
Filing Date:
March 02, 2021
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K1/02; H01L23/13; H05K3/28
Domestic Patent References:
| JP7147355A | ||||
| JP2018181972A | ||||
| JP2016111246A |
Attorney, Agent or Firm:
Seiko Ito
Hiroshi Kitahara
Satoshi Yamauchi
Ken Nakanishi
Hiroshi Kitahara
Satoshi Yamauchi
Ken Nakanishi
Previous Patent: Laser distance meter with improved display
Next Patent: Vehicle control device, vehicle control method, and program
Next Patent: Vehicle control device, vehicle control method, and program