Title:
配線欠陥検出方法および配線欠陥検出装置、並びに半導体基板の製造方法
Document Type and Number:
Japanese Patent JP5744212
Kind Code:
B2
Abstract:
A wiring fault detection method according to an embodiment of the present invention is capable of determining that, in a case where a temperature rise value of a faulty portion exceeds a temperature rise threshold within a preset threshold of the number of frames, a corresponding pixel has a fault. A wiring fault detection apparatus according to the present invention includes a temperature measurement imaging unit that measure a temperature of a semiconductor substrate and forms an image thereof.
Inventors:
Hiroshi Karita
Application Number:
JP2013531398A
Publication Date:
July 08, 2015
Filing Date:
August 30, 2012
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G01N25/72
Domestic Patent References:
| JP6207914A | ||||
| JP2002350491A | ||||
| JP2005503532A | ||||
| JP2003215081A | ||||
| JP11014576A | ||||
| JP2001337059A |
Attorney, Agent or Firm:
Harakenzo world patent & trademark