Title:
配線印刷物
Document Type and Number:
Japanese Patent JP7401378
Kind Code:
B2
Abstract:
To avoid cracks in a conductive layer in a wiring printed matter.SOLUTION: A wiring printed matter (10) includes a base material 22, a first insulating layer 24 formed on the base material 22, a conductive layer 16 formed on the first insulating layer 24, and a second insulating layer 26 that covers the conductive layer 16 together with the first insulating layer 24. The conductive layer 16 is formed using a conductive paste containing conductive flakes 18 and a binder 20 for joining the conductive flakes 18 as a starting material. Further, the bonding strength of the first insulating layer 24 and the second insulating layer 26 with respect to the conductive layer 16 is larger than the yield stress of the base material 22.SELECTED DRAWING: Figure 3
Inventors:
Yoshinori Tsurugi
Kenta Kasano
Kasane Nakazawa
Keisuke Yoshida
Kenta Kasano
Kasane Nakazawa
Keisuke Yoshida
Application Number:
JP2020059892A
Publication Date:
December 19, 2023
Filing Date:
March 30, 2020
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
H05K1/09
Domestic Patent References:
| JP2014090041A | ||||
| JP2010267607A | ||||
| JP2018198133A | ||||
| JP2014194943A |
Foreign References:
| WO2015025680A1 | ||||
| US20150305136 |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Tosuke Sekiguchi
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Tosuke Sekiguchi