Title:
CHUCK TABLE AND GRINDING APPARATUS
Document Type and Number:
Japanese Patent JP2019181634
Kind Code:
A
Abstract:
To prevent grinding debris from adhering to a holding surface of a chuck table holding a wafer, thus preventing a lower surface of the wafer from staining, when grinding water is sprayed from an outer peripheral side of the wafer toward the center.SOLUTION: In a chuck table 2, a disc-shaped porous plate 21 having a holding surface 211, which has a diameter substantially equal to a diameter of a wafer, is supported on a base 22. An annular portion 23 surrounds a side surface of the porous plate 21. The annular portion 23 includes: a ring upper surface 234 which is ring-shaped and is flush with the holding surface 211; and an outside surface extending downward from an outer peripheral edge of the ring upper surface 234. The outside surface is formed of: a drooping surface 231 drooping from the outer peripheral edge of the ring upper surface; and a divergent surface 232 which connects a lower end of the drooping surface 231 to an upper surface 224 of the base 22, and in which a diameter increases from the lower end of the drooping surface 231 toward the upper surface 224 of the base 22.SELECTED DRAWING: Figure 2
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Inventors:
GENOEN JIRO
ONAMI TAKESHI
ONAMI TAKESHI
Application Number:
JP2018076731A
Publication Date:
October 24, 2019
Filing Date:
April 12, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B24B7/04; B24B7/22; B24B49/04; H01L21/304; H01L21/683
Domestic Patent References:
JPH068087A | 1994-01-18 |
Foreign References:
CN103639875A | 2014-03-19 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office