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Title:
3D MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/194399
Kind Code:
A1
Abstract:
[Problem] Provided is a 3D molding device having high precision and productivity. [Solution] This 3D molding device (1) is characterized by being provided with: a support frame (11); a material supply unit (3) supported by the support frame (11); a molding subject carrying section (4) supported by the support frame (11) and at which the material supplied by the material supply unit (3) is carried; an input unit (51) to which the instructed motion amount for the table (41) is input ahead of time; a storage unit (52) that stores the instructed motion amount input via the input unit (51); and a control unit (50) that controls the material supply unit (3) and the molding subject carrying section (4). The 3D molding device (1) is further characterized by the molding subject carrying section (4) having a table (41), at the top surface of which the molding subject is carried, and a drive unit (45), which drives the table (41), and by the control unit (50) moving the table (41) by the instructed motion amount stored in the storage unit (52).

Inventors:
MURATA CHIKARA (JP)
INADA ATSUMORI (JP)
Application Number:
PCT/JP2015/066353
Publication Date:
December 23, 2015
Filing Date:
June 05, 2015
Export Citation:
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Assignee:
INST TECH PRECISION ELECT (JP)
International Classes:
B29C67/00; B22F3/105; B22F3/16; B33Y30/00; B33Y50/00
Domestic Patent References:
WO2010045382A12010-04-22
Foreign References:
JP2014104683A2014-06-09
JP2005297325A2005-10-27
JP2000127252A2000-05-09
JPH05318607A1993-12-03
JP2011241450A2011-12-01
Other References:
See also references of EP 3159143A4
Attorney, Agent or Firm:
KOYAMA, Takashi et al. (JP)
Takushi Koyama (JP)
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